Discover the transformative power of KT-8800 pre-treatment
Engineered for uniformity and optimal performance, KT-8800 provides excellent solder mask adhesion for a range of final finishes, including Electroless Nickel Immersion Gold (ENIG), Hot Air Solder Leveling (HASL), Silver, and other alternatives.
With KT-8800, you gain more than just improved adhesion; this pre-treatment process creates a uniquely roughened, etched copper topography, which not only enhances the adherence but also provides a more textured surface, offering a Ra greater than 0.5. Even on electrolytic plated panels, KT-8800 ensures a uniform etched appearance, which aids in creating more reliable, efficient printed circuit boards.
Expanding its range of applications, KT-8800 can also be utilized as an adhesion promoter for both dry film and liquid photo-resist applications. This versatility makes it an indispensable addition to your production process, improving the performance of a broad spectrum of surface treatments.
KT-8800 SPECIALTY FEATURES:
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Produces a copper surface with a rough surface Ra greater than 0.5.
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Provides stable and steady etching efficiency on copper surfaces.
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Compatible with horizontal machine system.
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Creates an adhesion bonding mechanism for solder mask, enhancing longevity and reliability
Invest in the KT-8800 pre-treatment process and experience the power of superior adhesion, consistent performance, and versatile application.